Flat suction cup for cleaning of computer chips with thickness of 10-20 microns. Integration of a connection for ESD ionizer. Geometry can only be manufactured with additive processes.
Presented at the booth of
Halle 2 / D 2121
How to clean multi-layer 10-20 microns thick computer chips without breaking them?
The idea for the illustrated showcase was established in December 2013. During development, the fixed predetermined position of the component and interfaces had to be taken into account with limited space. In addition, the integration of an ESD ionizer could be realized through a sophisticated geometry. This serves to reduce the electrostatic charge and thus prevents adhesion of dust particles on the computer chip.
The first prototype was already delivered in January 2014 to a customer to evaluate within operations. The ideal form was found at the first component. Nevertheless, customer-specific requirements and adjustments to the geometry can be implemented within just one hour.
The solution can be ordered as a standard option now thanks to the rapid testing and qualification with customers in the last 2 years.
Production of parts and assemblies
Besi AG Switzerland
Metal / Edelstahl / stainless steel / 1.4404 / 316L
Processor / Service provider
Wir sind der schweizerische Markt- und Technologieführer für Design, Produktion und Vertrieb von additiv gefertigten Produkten. Additive Technologien in der Dienstleistung stehen bei uns im Zentrum.
Halle 2 / D 2121
Get in contact with:
B. Sc. FHO
Research and development
Field of competence: Reverse- und Medical Engineering
Phone number: +41 712747320
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